| 发明名称 | Method of aerosol printing a solder mask ink composition | ||
| 摘要 | A method of digitally printing a solder mask. The method includes providing a solder mask ink composition including: 1) a resin and 2) a solvent in an amount of at least 20% by weight relative to the total weight of the solder mask ink composition. The composition has a viscosity that is less than 1000 cps at a shear rate of 10 s−1 and a temperature of 25° C. An aerosol stream is generated from the solder mask ink composition with a pneumatic atomizer using an atomization gas. The aerosol stream is directed through a nozzle and focused using a sheath gas onto a substrate while changing the position of the nozzle with respect to the substrate to selectively deposit a solder mask pattern. The solder mask pattern is cured. | ||
| 申请公布号 | US9606430(B2) | 申请公布日期 | 2017.03.28 |
| 申请号 | US201414471967 | 申请日期 | 2014.08.28 |
| 申请人 | XEROX CORPORATION | 发明人 | Wu Yiliang;Halfyard Kurt |
| 分类号 | B41J2/21;G03F1/68;B41J2/01;H05K3/34;H05K3/28 | 主分类号 | B41J2/21 |
| 代理机构 | MH2 Technology Law Group LLP | 代理人 | MH2 Technology Law Group LLP |
| 主权项 | 1. A method of digitally printing a solder mask, the method comprising: providing a solder mask ink composition comprising: 1) a resin and 2) a solvent in an amount of at least 20% by weight relative to the total weight of the solder mask ink composition, wherein the composition has a viscosity that is less than 1000 cps at a shear rate of 10 s−1 and a temperature of 25° C.; generating an aerosol stream from the solder mask ink composition with a pneumatic atomizer using an atomization gas; directing the aerosol stream through a nozzle and focusing the aerosol stream using a sheath gas onto a substrate while changing the position of the nozzle with respect to the substrate to selectively deposit a solder mask pattern; and curing the solder mask pattern. | ||
| 地址 | Norwalk CT US | ||