Micromechanical sensor device

摘要

A micromechanical sensor device, having a first unhoused sensor unit, and at least one second unhoused sensor unit, the sensor units being functionally connected to one another, the sensor units being essentially vertically configured one over the other so that a sensor unit having a larger footprint completely covers a sensor unit having a smaller footprint.

主权项

1. A micromechanical sensor device, comprising:
a first unhoused sensor unit; and at least one second unhoused sensor unit, the second unhoused sensor unit having a smaller footprint than the first unhoused sensor unit; wherein:
the sensor units are functionally connected to one another,the sensor units are essentially vertically configured one over the other so that the first sensor unit completely covers the second sensor unit,the sensor units are functionally connected to one another by first solder bumps,the sensor device externally contactable by second solder bumps, anda vertical extension of the second solder bumps is larger than an overall vertical extension of the first solder bumps and the second sensor unit.