发明名称 Conductive interconnected porous film and method of production of same
摘要 A new conductive interconnected porous film, useful as a material for a gas diffusion layer which is used in a solid polymer type fuel cell, which satisfies the requirements of a good conductivity, good gas permeability, surface smoothness, corrosion resistance, and low impurities and which is strong in bending and excellent in handling to an extent not obtainable by existing sheet materials of carbon fiber, that is, a conductive interconnected porous film wherein a resin base material part of a thermoplastic resin has a porous interconnected cell structure which is formed by removal of removable particulate matter and has cells of sizes of 10 μm to 50 μm and wherein the resin base material part is comprised of different particle size particles of first carbon particles of large size carbon particles of a diameter of 5 μm or more and second carbon particles of micro size carbon particles of a diameter of 10 nm or more mixed together, and a method of production of the same.
申请公布号 US9608281(B2) 申请公布日期 2017.03.28
申请号 US201214355312 申请日期 2012.11.20
申请人 FUTAMURA KAGAKU KABUSHIKI KAISHA 发明人 Imaizumi Takuzo;Nagata Hiroaki;Shiba Naoki
分类号 H01M8/0243;H01M8/02;C08J9/26;H01B1/24;C08J9/00;H01M8/10 主分类号 H01M8/0243
代理机构 Cheng Law Group, PLLC 代理人 Cheng Law Group, PLLC
主权项 1. A conductive interconnected porous film, comprising: a resin base material part, wherein the resin base material part has a porous interconnected cell structure which is formed by removal of removable particulate matter, said resin base material part is comprised of first carbon particles and second carbon particles of different particle sizes mixed together, said first carbon particles have a diameter of 5 μm or more and are carbon fiber or spherical graphite particles, and said second carbon particles have a diameter of 10 nm or more and are carbon nanotube particles, the time required for permeation of air of the conductive interconnected porous film is 72 seconds or less, the resistivity of the conductive interconnected porous film is 0.4 Ω·cm or less, and the thickness of the conductive interconnected porous film is 50 μm to 1000 μm.
地址 Aichi JP