Body of doped semiconductor material having scattering centers of non-doping atoms of foreign matter disposed between two layers of opposing conductivities

摘要

A method for producing a body (1) consisting of doped semiconductor material having a defined mean free path length (lambda n) for free charge carriers (CP), and a mean free path length (lambda r) for the free charge carriers (CP) which is smaller than the defined mean free path length (lambda n) is disclosed. An epitactic crystal layer (20) consisting of doped semiconductor material is produced on a substrate crystal (10) consisting of semiconductor material having the defined mean free path length (lambda n), said crystal layer having, at least locally, a mean free path length (lambda r) for the free charge carriers (CP) which is smaller than the defined mean free path length (lambda n). The body (1) can also be produced by joining two crystal bodies (10′, 10″) consisting of doped semiconductor material.

主权项

1. A Semiconductor device with a pn-junction, the semiconductor device comprising:
a substrate crystal of doped silicon with a predefined mean free path length for free charge carriers; and an epitaxial crystal layer of an n-doped silicon on the substrate crystal, wherein a pn-junction is formed between the semiconductor crystal and the crystal layer or at a side of the crystal layer opposite to the semiconductor crystal, wherein the crystal layer comprises at least locally non-doping germanium atoms or carbon atoms, or both, as scattering centers introduced during the crystal growth and the crystal layer has a mean free path length for free charge carriers smaller than the predefined mean free path length, and wherein the mean free path length in the n-doped crystal layer varies such that the mean free path length is more reduced, relative to the predefined mean free path length, in those areas of the n-doped crystal layer in which an electrical field strength is higher when a blocking voltage is applied to the pn-junction, and such that the mean free path length is reduced less, relative to the predefined mean free path length, in those areas of the n-doped crystal layer where the field strength is smaller when a blocking voltage is applied to the pn-junction.