Electromagnetic wave shielding film and method for producing a circuit board comprising the shielding film

摘要

The present invention discloses an electromagnetic wave shielding film, comprising at least one electromagnetic shielding layer. A printed circuit board comprising the shielding film, is formed by tightly connecting the electromagnetic wave shielding film with the printed circuit board in the direction of thickness, wherein a ground layer is disposed on said printed circuit board. A method for producing the circuit board, including the following steps: (1) hot-pressing and curing the electromagnetic shielding film with the circuit board in the direction of thickness; (2) piercing the adhesive film layer by a rough surface of the electromagnetic shielding layer, to achieve grounding. Or, including the following steps: (1) hot-pressing and curing the electromagnetic shielding film with the circuit board in the direction of thickness; (2) piercing the shielding film by an electrically conductive substance, to achieve grounding. Or, including the following steps: (1) hot-pressing and curing the electromagnetic shielding film with the circuit board in the direction of thickness; (2) forming through holes or blind holes in the circuit board; (3) metallizing the holes, to achieve grounding. The adhesive film layer of the shielding film of the present invention contains no conductive particle, so that the cost and the insertion loss are reduced, and the development demand of high-speed and high-frequency of the electronic products is met.

主权项

1. An electromagnetic wave shielding film, comprising at least one electromagnetic shielding layer having at least a first and second side, wherein an insulating layer is disposed on the first side of said electromagnetic shielding layer and an adhesive film layer is disposed on the second side of said electromagnetic shielding layer, wherein the adhesive film layer of the shielding film is nonconductive, and the second side of the electromagnetic shielding layer is characterized by a roughness sufficient to pierce the adhesive film layer.