Image pickup unit and method for manufacturing the same

摘要

An image pickup unit according to the embodiment includes an image pickup device chip having a rectangular shape in plan view, a transparent substrate which is equal in plan view dimensions to the image pickup device chip and is joined to the image pickup device chip, and a lens unit joined to the transparent substrate with the center of a light receiving portion of the image pickup chip aligned with the optical axis, in which, two locking portions are formed in the transparent substrate and two locked portions of the lens unit which is equal to or smaller than the image pickup device chip in plan view dimensions are fitted into or abut on the corresponding locking portions respectively.

主权项

1. An image pickup unit comprising:
an image pickup device chip having a rectangular shape in plan view; a transparent substrate which is equal in plan view dimensions to the image pickup device chip and is joined to the image pickup device chip, the transparent substrate including one or two locking portions formed therein; and a lens unit joined to the transparent substrate so that an optical axis of the lens unit is aligned with a center of a light receiving portion of the image pickup device chip; wherein plan view dimensions of the lens unit in a direction of the optical axis are equal to or smaller than plan view dimensions the transparent substrate; one or two locked portions of the lens unit are fitted into or abut on the corresponding locking portions; and the one or two locked portions have a height smaller than a depth of the one or two locking portions.