发明名称 Antenna module
摘要 An antenna module includes an antenna element including coil patterns and via conductors coupling together two adjacent two coil patterns. At least one of the coil patterns has a spiral shape, is wound three or more turns parallel or substantially parallel to an outer edge of a principal surface of a multilayer body, includes a first partial pattern including an outer end portion, a second partial pattern extending parallel or substantially parallel with the first partial pattern and being adjacent to the first partial pattern with a first gap provided therebetween, and a third partial pattern extending parallel or substantially parallel with the second partial pattern and being adjacent to the second partial pattern with a second gap provided therebetween, the second gap being smaller than the first gap.
申请公布号 US9607258(B2) 申请公布日期 2017.03.28
申请号 US201514629536 申请日期 2015.02.24
申请人 Murata Manufacturing Co., Ltd. 发明人 Murayama Hiromi;Dokai Yuya;Mukai Tsuyoshi;Higashibata Kazuaki;Nomura Masato;Kato Noboru
分类号 G06K19/06;G06K19/077;H01F38/14;H01Q7/00;H01Q1/22 主分类号 G06K19/06
代理机构 Keating & Bennett, LLP 代理人 Keating & Bennett, LLP
主权项 1. A structure for attachment of an antenna module to an object article, wherein: the antenna module includes a multilayer body including a plurality of insulative layers, a first principal surface, a second principal surface, an IC chip provided on or in the multilayer body, and an antenna element coupled to the IC chip; the antenna element includes a plurality of coil patterns arranged in a stacking direction of the insulative material of the multilayer body; the antenna module is attached to the object article with the first principal surface of the multilayer body defining an attachment surface of the multilayer body to the object article; one of the plurality of coil patterns arranged farther from the first principal surface includes a larger number of turns than another one of the plurality of coil patterns arranged nearer to the first principal surface than the one of the plurality of coil patterns; and the IC chip is provided on one of the first principal surface and the second principal surface of the multilayer body.
地址 Kyoto JP