发明名称 |
Antenna module |
摘要 |
An antenna module includes an antenna element including coil patterns and via conductors coupling together two adjacent two coil patterns. At least one of the coil patterns has a spiral shape, is wound three or more turns parallel or substantially parallel to an outer edge of a principal surface of a multilayer body, includes a first partial pattern including an outer end portion, a second partial pattern extending parallel or substantially parallel with the first partial pattern and being adjacent to the first partial pattern with a first gap provided therebetween, and a third partial pattern extending parallel or substantially parallel with the second partial pattern and being adjacent to the second partial pattern with a second gap provided therebetween, the second gap being smaller than the first gap. |
申请公布号 |
US9607258(B2) |
申请公布日期 |
2017.03.28 |
申请号 |
US201514629536 |
申请日期 |
2015.02.24 |
申请人 |
Murata Manufacturing Co., Ltd. |
发明人 |
Murayama Hiromi;Dokai Yuya;Mukai Tsuyoshi;Higashibata Kazuaki;Nomura Masato;Kato Noboru |
分类号 |
G06K19/06;G06K19/077;H01F38/14;H01Q7/00;H01Q1/22 |
主分类号 |
G06K19/06 |
代理机构 |
Keating & Bennett, LLP |
代理人 |
Keating & Bennett, LLP |
主权项 |
1. A structure for attachment of an antenna module to an object article, wherein:
the antenna module includes a multilayer body including a plurality of insulative layers, a first principal surface, a second principal surface, an IC chip provided on or in the multilayer body, and an antenna element coupled to the IC chip; the antenna element includes a plurality of coil patterns arranged in a stacking direction of the insulative material of the multilayer body; the antenna module is attached to the object article with the first principal surface of the multilayer body defining an attachment surface of the multilayer body to the object article; one of the plurality of coil patterns arranged farther from the first principal surface includes a larger number of turns than another one of the plurality of coil patterns arranged nearer to the first principal surface than the one of the plurality of coil patterns; and the IC chip is provided on one of the first principal surface and the second principal surface of the multilayer body. |
地址 |
Kyoto JP |