发明名称 Assembled battery and power consumption apparatus
摘要 An assembled battery includes a plurality of secondary battery cell series modules each having a plurality of secondary battery cells connected in series, wherein in each secondary battery cell series module, the secondary battery cells are connected in series by a first connection member, the secondary battery cell constituting the secondary battery cell series module and the secondary battery cell constituting the secondary battery cell series module adjacent to the above secondary battery cell series module are connected in parallel by a second connection member, the electrical resistance value of the second connection member is higher than the electrical resistance value of the first connection member, and the melting point of a material constituting the second connection member is lower than the melting point of a material constituting the first connection member.
申请公布号 US9608248(B2) 申请公布日期 2017.03.28
申请号 US201113274792 申请日期 2011.10.17
申请人 Sony Corporation 发明人 Hotta Shin;Uesaka Shinichi
分类号 H01M2/20;H01M2/34;H01M10/052;H02J7/00 主分类号 H01M2/20
代理机构 K&L Gates LLP 代理人 K&L Gates LLP
主权项 1. An assembled battery comprising: a plurality of secondary battery cell series modules each having a plurality of secondary battery cells connected in series, the plurality of secondary battery cell series modules including a first secondary battery cell series module and a second secondary battery cell series module adjacent to the first secondary battery cell series module, a first connection member that connects in series the secondary battery cells of each of the plurality of secondary battery cell series modules, and a second connection member that connects in parallel the first secondary battery cell series module and the second secondary battery cell series module, wherein an electrical resistance value of the second connection member is higher than an electrical resistance value of the first connection member, wherein a melting point of a material comprising the second connection member is lower than a melting point of a material comprising the first connection member, wherein the material comprising the first connection member is selected from the group consisting of: copper, aluminum, nickel, chrome and alloys thereof, and wherein the material comprising the second connection member is selected from the group consisting of: indium, an indium-gold based alloy; Sn80Ag20, Sn95Cu5, Pb97.5Ag2.5, Pb94.5Ag5.5, and Pb97.5Ag1.5Sn1.0.
地址 Tokyo JP