发明名称 |
Integrated circuits with spacer chamfering and methods of spacer chamfering |
摘要 |
Semiconductor devices and methods for forming the devices with spacer chamfering. One method includes, for instance: obtaining a wafer with at least one source, at least one drain, and at least one fin; forming at least one sacrificial gate with at least one barrier layer; forming a first set of spacers adjacent to the at least one sacrificial gate; forming at least one second set of spacers adjacent to the first set of spacers; and etching to remove a portion of the first set of spacers above the at least one barrier layer to form a widened opening. An intermediate semiconductor device is also disclosed. |
申请公布号 |
US9608087(B2) |
申请公布日期 |
2017.03.28 |
申请号 |
US201514681428 |
申请日期 |
2015.04.08 |
申请人 |
GLOBALFOUNDRIES Inc. |
发明人 |
Zang Hui |
分类号 |
H01L21/336;H01L29/66;H01L21/3213;H01L29/78 |
主分类号 |
H01L21/336 |
代理机构 |
Heslin Rothenberg Farley & Mesiti P.C. |
代理人 |
Heslin Rothenberg Farley & Mesiti P.C. ;Graff Jacquelyn |
主权项 |
1. A method comprising:
obtaining a wafer with at least one source, at least one drain, and at least one fin; forming at least one sacrificial gate with at least one barrier layer, comprising:
depositing a first polysilicon layer over the wafer;forming the at least one barrier layer over the first polysilicon layer;depositing a second polysilicon layer over the barrier layer; anddepositing a hard mask layer over the second polysilicon layer; forming a first set of spacers adjacent to the at least one sacrificial gate; forming at least one second set of spacers adjacent to the first set of spacers; and etching to remove a portion of the first set of spacers above the at least one barrier layer to form a widened opening. |
地址 |
Grand Cayman KY |