Printed circuit board and image forming apparatus

摘要

A printed circuit board, including: a substrate on which a component is mounted by solder; and a contact plate having a soldered portion soldered on the substrate, the contact plate being configured to be brought into contact with a contact of an apparatus to which the substrate is to be attached, wherein the soldered portion is soldered on a surface of the substrate opposite to a surface of the substrate on which the component is mounted, and wherein the contact plate has a suppressing portion configured to suppress an adhesion of a flux of the solder to a portion in which the contact plate is to be contacted by the contact, the suppressing portion making a flow path of the flux from the soldered portion to the portion longer than a straight-line distance from the soldered portion to the portion.

主权项

1. A printed circuit board, comprising:
a substrate on which a component which constitutes a circuit is configured to generate a high voltage is mounted by solder; and a contact plate including a soldered portion soldered on the substrate, the contact plate being configured to be brought into contact with a spring contact, to which the high voltage is applied, mounted in an apparatus to which the substrate is to be attached, wherein the contact plate is attached to the substrate by the soldered portion being soldered on a surface of the substrate opposite to a surface of the substrate on which the component is mounted, and wherein the contact plate includes a suppressing portion configured to suppress an adhesion of a flux of the solder to a contact portion in which the contact plate is to be contacted by the spring contact, the suppressing portion making a creeping distance of the contact plate on which the flux of the solder flows from the soldered portion to the contact portion longer than a straight-line distance from the soldered portion to the contact portion.