发明名称 Thin film encapsulation structure and organic light emitting device having the same
摘要 The present disclosure provides a thin film encapsulation structure for encapsulating a functional device on a substrate, including: a mixing layer thin film covering the functional device, and an inorganic layer thin film located above the mixing layer thin film, wherein the mixing layer thin film is mainly composed of amorphous aluminum oxide and a crystalline oxide. The present disclosure also provides an organic light emitting device, including a substrate, an OLED device located on the substrate, and the thin film encapsulation structure as mentioned above.
申请公布号 US9608235(B2) 申请公布日期 2017.03.28
申请号 US201615062573 申请日期 2016.03.07
申请人 EverDisplay Optronics (Shanghai) Limited 发明人 Xiao Ling;Li Guifang;Hu Niu
分类号 H01L21/56;H01L51/52;C23C14/06;C23C14/08;C23C14/34;H01L21/02 主分类号 H01L21/56
代理机构 代理人 Ren Yunling
主权项 1. A thin film encapsulation structure for encapsulating a functional device on a substrate, comprising: a mixing layer thin film covering the functional device, and an inorganic layer thin film located above the mixing layer thin film, wherein the mixing layer thin film is mainly composed of amorphous aluminum oxide and a crystalline oxide.
地址 Shanghai CN