发明名称 |
Solid-state imaging apparatus, method of manufacturing the same, and electronic apparatus |
摘要 |
A solid-state imaging apparatus includes an imaging region in which pixels are arranged, a connection region that surrounds the imaging region and includes an electrode pad, and an in-layer lens that is formed in the imaging region for each of the pixels. The in-layer lens is formed of a coating-type high-refractive-index material. The connection region includes an opening that is formed such that an upper surface of the electrode pad is exposed from the high-refractive-index material applied to the electrode pad. |
申请公布号 |
US9608030(B2) |
申请公布日期 |
2017.03.28 |
申请号 |
US201414338929 |
申请日期 |
2014.07.23 |
申请人 |
Sony Semiconductor Solutions Corporation |
发明人 |
Horikoshi Hiroshi |
分类号 |
H01L27/146 |
主分类号 |
H01L27/146 |
代理机构 |
Sheridan Ross P.C. |
代理人 |
Sheridan Ross P.C. |
主权项 |
1. A method of manufacturing a solid-state imaging apparatus including an imaging region in which pixels are arranged, a connection region that surrounds the imaging region and includes an electrode pad, and an in-layer lens that is formed in the imaging region for each of the pixels, the method comprising:
forming a refractive-index layer including a refractive-index material in the imaging region and the connection region, wherein the refractive-index material is formed on the electrode pad; forming the in-layer lens and an opening that exposes an upper surface of the electrode pad in the connection region by etching back the refractive-index material in the imaging region and in the connection region; and monitoring an emission wavelength caused by the electrode pad being etched by plasma while etching back the refractive-index material formed on the electrode pad. |
地址 |
Kanagawa JP |