发明名称 Solid-state imaging apparatus, method of manufacturing the same, and electronic apparatus
摘要 A solid-state imaging apparatus includes an imaging region in which pixels are arranged, a connection region that surrounds the imaging region and includes an electrode pad, and an in-layer lens that is formed in the imaging region for each of the pixels. The in-layer lens is formed of a coating-type high-refractive-index material. The connection region includes an opening that is formed such that an upper surface of the electrode pad is exposed from the high-refractive-index material applied to the electrode pad.
申请公布号 US9608030(B2) 申请公布日期 2017.03.28
申请号 US201414338929 申请日期 2014.07.23
申请人 Sony Semiconductor Solutions Corporation 发明人 Horikoshi Hiroshi
分类号 H01L27/146 主分类号 H01L27/146
代理机构 Sheridan Ross P.C. 代理人 Sheridan Ross P.C.
主权项 1. A method of manufacturing a solid-state imaging apparatus including an imaging region in which pixels are arranged, a connection region that surrounds the imaging region and includes an electrode pad, and an in-layer lens that is formed in the imaging region for each of the pixels, the method comprising: forming a refractive-index layer including a refractive-index material in the imaging region and the connection region, wherein the refractive-index material is formed on the electrode pad; forming the in-layer lens and an opening that exposes an upper surface of the electrode pad in the connection region by etching back the refractive-index material in the imaging region and in the connection region; and monitoring an emission wavelength caused by the electrode pad being etched by plasma while etching back the refractive-index material formed on the electrode pad.
地址 Kanagawa JP