发明名称 |
Semiconductor structure and fabrication method thereof, and static random access memory cell |
摘要 |
A method for forming a semiconductor having a plurality of FinFETs. The method includes providing a semiconductor substrate having a surface; and forming a plurality of first fins and a plurality of second fins on the surface of the semiconductor substrate. Further, the method also includes forming a mask layer on top surfaces of the plurality of first fins and the plurality of second fins; and forming an insulation material layer covering side surfaces of the first fins, the second fins and the mask layer. Further, the method includes removing a portion of the mask layer on the first fins; and forming a continuous first gate structure covering side and top surfaces of a plurality of first fins and a discontinuous second gate structure covering only the side surfaces of the second fins and the side surfaces of the mask layer. |
申请公布号 |
US9607995(B2) |
申请公布日期 |
2017.03.28 |
申请号 |
US201614986979 |
申请日期 |
2016.01.04 |
申请人 |
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION |
发明人 |
Ju Jianhua;Yu Shaofeng |
分类号 |
H01L21/00;H01L21/84;H01L27/11;H01L21/326;H01L29/66;H01L29/78;H01L21/8234;H01L27/088;H01L21/8238;H01L27/092 |
主分类号 |
H01L21/00 |
代理机构 |
Anovo Law Group, PLLC |
代理人 |
Anovo Law Group, PLLC |
主权项 |
1. A method for fabricating a semiconductor structure having a plurality of FinFETs, comprising:
providing a semiconductor substrate having a surface; forming a plurality of first fins and a plurality of second fins on the surface of the semiconductor substrate; forming a mask layer on top surfaces of the plurality of first fins and the plurality of second fins; forming an insulation material layer covering side surfaces of the first fins, the second fins and the mask layer; removing a portion of the mask layer on the first fins; and forming a continuous first gate structure covering side and top surfaces of a plurality of first fins and a discontinuous second gate structure covering only the side surfaces of the second fins and the side surfaces of the mask layer. |
地址 |
Shanghai CN |