| 发明名称 | Bonding structure and flexible device | ||
| 摘要 | A bonding structure comprising a contact pad, an anisotropic conductive film (ACF) and a contact structure is provided. The contact pad includes at least one recess, wherein a thickness of the contact pad is T, and a width of the at least one recess is B, The ACF is disposed on the contact pad and includes a plurality of conductive particles; each of the conductive particles is disposed in the at least one recess. A diameter of the conductive particles is A, and A is larger than B and T and satisfies B≦2(AT−T2)1/2. The contact structure is disposed on the ACF and electrically connected to the contact pad via the conductive particles. The disclosure also provides a flexible device including a substrate, a patterned insulating layer, at least one contact pad, ACF, and a contact structure. | ||
| 申请公布号 | US9607960(B1) | 申请公布日期 | 2017.03.28 |
| 申请号 | US201514983506 | 申请日期 | 2015.12.29 |
| 申请人 | Industrial Technology Research Institute | 发明人 | Peng Yi-Cheng;Yeh Ming-Hua |
| 分类号 | H01L23/00;H01L23/498;H01L23/48 | 主分类号 | H01L23/00 |
| 代理机构 | Jianq Chyun IP Office | 代理人 | Jianq Chyun IP Office |
| 主权项 | 1. A bonding structure, comprising: a contact pad, comprising at least one recess, wherein a thickness of the contact pad is T and a width of the at least one recess is B; an anisotropic conductive film, disposed on the contact pad and comprising a plurality of conductive particles, each of the conductive particles is disposed in the at least one recess, wherein a diameter of each of the conductive particles is A, and A is larger than B and T, and satisfies B≦2(AT−T2)1/2; and a contact structure, disposed on the anisotropic conductive film and electrically connected to the contact pad via the conductive particles. | ||
| 地址 | Hsinchu TW | ||