Electrical characteristics of package substrates and semiconductor packages including the same

摘要

Package substrates are provided. The package substrate may include a power line and a ground line on a first surface of a substrate body; a plurality of signal lines on the first surface between the power line and the ground line; and a lower ground pattern and a lower power pattern positioned on a second surface of the substrate body opposite to the first surface. The lower ground pattern may be disposed to be opposite to the power line and the lower power pattern may be disposed to be opposite to the ground line. Related semiconductor packages are also provided.

主权项

1. A package substrate comprising:
a power line and a ground line configured on a first surface of a substrate body; two or more signal lines on the first surface between the power line and the ground line; and a lower ground pattern and a lower power pattern positioned on a second surface of the substrate body opposite to the first surface, wherein the lower ground pattern is overlapped with the power line in a vertical direction, and the lower power pattern is overlapped with the ground line in the vertical direction, wherein the lower ground pattern and the lower power pattern are in direct contact with the second surface of the substrate body, and wherein the lower ground pattern continuously extends in a horizontal direction so as to cover the power line and one of the two or more signal lines.