| 发明名称 | Package substrate and electronic device | ||
| 摘要 | In a package substrate, adjacent bumps in a first array of bumps being an outermost array arranged along a first side of the package substrate are arranged being shifted in a first axial direction that is a normal direction of the first side and in a second axial direction that intersects perpendicularly with the first axial direction in a plan view. Adjacent bumps in a second array of bumps arranged in the inside of the first array of bumps are arranged being shifted in the first axial direction and in the second axial direction in a plan view. | ||
| 申请公布号 | US9609750(B2) | 申请公布日期 | 2017.03.28 |
| 申请号 | US201313930616 | 申请日期 | 2013.06.28 |
| 申请人 | RENESAS ELECTRONICS CORPORATION | 发明人 | Kanzaki Shingo |
| 分类号 | H05K1/11;H05K7/00;H01L23/498;H01L23/50;H05K3/00 | 主分类号 | H05K1/11 |
| 代理机构 | Young & Thompson | 代理人 | Young & Thompson |
| 主权项 | 1. A package substrate, comprising: a first array of bumps that is an outermost array arranged along a first side of the package substrate, adjacent bumps of the first array of bumps being shifted in relation to respective adjacent bumps in a first axial direction that is a normal direction of the first side and in a second axial direction that intersects perpendicularly with the first axial direction in a plan view; and a second array of bumps arranged in the inside of the first array of bumps, a plurality of bumps of the second array of bumps being shifted in relation to all respective adjacent bumps to the plurality of bumps in the first axial direction and in the second axial direction in a plan view. | ||
| 地址 | Kanagawa JP | ||