PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF

摘要

A manufacturing method of a package carrier is provided. A substrate having a through hole is provided, wherein a profile of the through hole from top view is a first rounded rectangular. A heat conducting slug is disposed inside the through hole, wherein the heat conducting slug and an inner wall of the through hole are separated with a gap, and a profile of the heat conducting slug from top view is a second rounded rectangular. An insulating material is filled in the through hole so as to fix the heat conducting slug in the through hole. A conductive through hole structure, a first and a second patterned circuit layers are formed. The first and the second patterned circuit layers are respectively formed on two opposite sides of the substrate. The conductive through hole structure penetrates the substrate and connects portions of the first and the second patterned circuit layers.

主权项

1. A manufacturing method of a package carrier, comprising:
providing a substrate having a through hole, wherein a profile of the through hole from top view is a first rounded rectangular; disposing a heat conducting slug inside the through hole of the substrate, wherein the heat conducting slug and an inner wall of the through hole are separated with a gap, and a profile of the heat conducting slug from top view is a second rounded rectangular; filling the through hole of the substrate with an insulating material so as to fix the heat conducting slug in the through hole via the insulating material; and forming a conductive through hole structure, a first patterned circuit layer and a second patterned circuit layer, wherein the first patterned circuit layer and the second patterned circuit layer are respectively formed on two opposite sides of the substrate and expose a portion of the substrate, the conductive through hole structure penetrates the substrate and connects a portion of the first patterned circuit layer and a portion of the second patterned circuit layer.