发明名称 SEMICONDUCTOR STRUCTURE AND THE MANUFACTURING METHOD THEREOF
摘要 The present disclosure provides a FinFET. The FinFET includes a silicon-on-insulator (SOI) with an insulator; a plurality of fin structures on the insulator; an isolation on the insulator, and between two adjacent fin structures in the plurality of fin structures; and an oxide layer between each of the plurality of fin structures and the insulator, wherein the insulator comprises silicon germanium oxide. A method for manufacturing the FinFET includes forming a plurality of fin structures on a layer having a larger lattice constant than that of the fin structure by a patterning operation; oxidizing the fin structure and the layer to transform the layer into a first oxide layer; filling insulating material between adjacent fin structures; and etching the insulating material to expose a top surface and at least a portion of a sidewall of the fin structure.
申请公布号 US2017084746(A1) 申请公布日期 2017.03.23
申请号 US201615370841 申请日期 2016.12.06
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. 发明人 LEE YI-JING;WU CHENG-HSIEN;KO CHIH-HSIN;WANN CLEMENT HSINGJEN
分类号 H01L29/78;H01L29/06;H01L29/66;H01L21/02;H01L21/762 主分类号 H01L29/78
代理机构 代理人
主权项 1. A method of manufacturing a FINFET, comprising: forming a plurality of fin structures on a layer having a larger lattice constant than that of the fin structure by a patterning operation; oxidizing the fin structure and the layer to transform the layer into a first oxide layer; filling insulating material between adjacent fin structures; and etching the insulating material to expose a top surface and at least a portion of a sidewall of the fin structure.
地址 HSINCHU TW