TERMINAL STRUCTURE FOR ACTIVE POWER DEVICE

摘要

A semiconductor die comprising a terminal structure for an active power device. The terminal structure comprises a metallic layer arranged to be electrically coupled between the active power device and an external contact of an integrated circuit package, a conductive sub-structure extending in parallel with the metallic layer, and located such that, when mounted within an integrated circuit device, the conductive sub-structure lies between the metallic layer and a reference voltage plane, and interconnecting elements extending between the metallic layer and the conductive sub-structure and electrically coupling the metallic layer to the conductive sub-structure. The plurality of interconnecting elements comprise first and second interconnecting elements extending between first and second lateral end regions of the metallic layer and the conductive sub-structure respectively such that the first and second interconnecting elements are laterally spaced with respect to the direction of travel of the fundamental signal for the active power device.

主权项

1. A semiconductor die comprising at least one active power device and at least one terminal structure; the at least one terminal structure comprising:
a fundamental signal layer arranged to be electrically coupled between the at least one active power device and an external contact of an integrated circuit package; a conductive sub-structure extending in parallel with the fundamental signal layer, and located such that, when mounted within an integrated circuit device, the conductive sub-structure lies between the fundamental signal layer and a reference voltage plane; and a plurality of interconnecting elements extending between the fundamental signal layer and the conductive sub-structure, and electrically coupling the fundamental signal layer to the conductive sub-structure, wherein the plurality of interconnecting elements comprise
a first interconnecting element extending between a first lateral end region of the fundamental signal layer and the conductive sub-structure; anda second interconnecting element extending between a second lateral end region of the fundamental signal layer and the conductive sub-structure such that the first and second interconnecting elements are laterally spaced with respect to the direction of travel of the fundamental signal for the at least one active power device.