发明名称 |
THERMALLY CONDUCTIVE POLYMER COMPOSITION AND THERMALLY CONDUCTIVE MOLDED OBJECT |
摘要 |
The present invention provides a thermal conductive polymer composition with low probability for mixing of an air bubble in a thermal conductive molded article, which is a thermal conductive polymer composition including thermal conductive inorganic particles having a specific particle size distribution and an electrically insulating polymer. |
申请公布号 |
US2017081579(A1) |
申请公布日期 |
2017.03.23 |
申请号 |
US201415307763 |
申请日期 |
2014.12.16 |
申请人 |
NITTO DENKO CORPORATION ;NITTO SHINKO CORPORATION |
发明人 |
FUJIKAWA Kenichi;HATAKEYAMA Yoshiharu;YAMAGUCHI Miho;YAMAGISHI Yuji;OOHASHI Akihiro |
分类号 |
C09K5/14;C08K3/22;C08K3/28 |
主分类号 |
C09K5/14 |
代理机构 |
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代理人 |
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主权项 |
1. A thermal conductive polymer composition comprising: thermal conductive inorganic particles; and an electrically insulating polymer,
wherein the thermal conductive inorganic particles comprise a first component containing boron nitride particles in an aggregated state and a second component which is a component other than the first component, a content of the second component in the thermal conductive inorganic particles is from 5 to 55 vol %, and the thermal conductive inorganic particles satisfy all requirements of the following (1) to (3):
(1) to contain particles having a particle diameter of 10 μm to 400 μm in an amount of 80 vol % or more,(2) to contain particles having a particle diameter of 20 μm to 400 μm in an amount of 60 vol % or more, and(3) to contain particles having a particle diameter of 30 μm to 400 μm in an amount of 40 vol % or more. |
地址 |
Ibaraki-shi, Osaka JP |