发明名称 THERMALLY CONDUCTIVE POLYMER COMPOSITION AND THERMALLY CONDUCTIVE MOLDED OBJECT
摘要 The present invention provides a thermal conductive polymer composition with low probability for mixing of an air bubble in a thermal conductive molded article, which is a thermal conductive polymer composition including thermal conductive inorganic particles having a specific particle size distribution and an electrically insulating polymer.
申请公布号 US2017081579(A1) 申请公布日期 2017.03.23
申请号 US201415307763 申请日期 2014.12.16
申请人 NITTO DENKO CORPORATION ;NITTO SHINKO CORPORATION 发明人 FUJIKAWA Kenichi;HATAKEYAMA Yoshiharu;YAMAGUCHI Miho;YAMAGISHI Yuji;OOHASHI Akihiro
分类号 C09K5/14;C08K3/22;C08K3/28 主分类号 C09K5/14
代理机构 代理人
主权项 1. A thermal conductive polymer composition comprising: thermal conductive inorganic particles; and an electrically insulating polymer, wherein the thermal conductive inorganic particles comprise a first component containing boron nitride particles in an aggregated state and a second component which is a component other than the first component, a content of the second component in the thermal conductive inorganic particles is from 5 to 55 vol %, and the thermal conductive inorganic particles satisfy all requirements of the following (1) to (3): (1) to contain particles having a particle diameter of 10 μm to 400 μm in an amount of 80 vol % or more,(2) to contain particles having a particle diameter of 20 μm to 400 μm in an amount of 60 vol % or more, and(3) to contain particles having a particle diameter of 30 μm to 400 μm in an amount of 40 vol % or more.
地址 Ibaraki-shi, Osaka JP