发明名称 ETCHING METHOD AND METHOD OF FABRICATING A SEMICONDUCTOR DEVICE USING THE SAME
摘要 The present disclosure relates to an etchant, a method of making an etchant, an etching method and a method of fabricating a semiconductor device using the same. The etching method includes supplying an etchant on an etch-target layer to etch the etch-target layer in a wet etch manner. The etchant contains a basic compound and a sugar alcohol, and the basic compound contains ammonium hydroxide or tetraalkyl ammonium hydroxide. In the etchant, the sugar alcohol has 0.1 to 10 parts by weight for every 100 parts by weight of the basic compound.
申请公布号 US2017084719(A1) 申请公布日期 2017.03.23
申请号 US201615229930 申请日期 2016.08.05
申请人 Samsung Electronics Co., Ltd. 发明人 KIM Hoyoung;BAE SANG WON;BAEK Jae-Jik;CHOI Wonsang
分类号 H01L29/66;C09K13/00;H01L21/3213;H01L21/28;H01L21/3205 主分类号 H01L29/66
代理机构 代理人
主权项 1. A method of manufacturing a semiconductor device, comprising: supplying an etchant on an etch-target layer on a semiconductor substrate to etch the etch-target layer with a wet etch process, wherein the etchant comprises a basic compound and a sugar alcohol, wherein the basic compound comprises ammonium hydroxide or tetraalkyl ammonium hydroxide, and wherein, in the etchant, the sugar alcohol has 0.1 to 10 parts by weight for every 100 parts by weight of the basic compound.
地址 Suwon-si KR