发明名称 |
LIGHT-EMITTING ELEMENT AND LIGHT-EMITTING DEVICE |
摘要 |
A light-emitting element includes a light transmissive substrate; a first semiconductor stacked body including: a first n-side semiconductor layer, and a first p-side semiconductor layer, the first p-side semiconductor layer having a hole formed therein; a first p-electrode; a first n-electrode having a portion above the first p-electrode, and a portion extending into the hole, the first n-electrode being electrically connected to the first n-side semiconductor layer through the hole; a second semiconductor stacked body including: a second n-side semiconductor layer located around a periphery of the first semiconductor stacked body, and a second p-side semiconductor layer located above the second n-side semiconductor layer and located outside of an inner edge portion of the second n-side semiconductor layer; a second p-electrode; and a second n-electrode having a portion above the second p-electrode, and being electrically connected to the inner edge portion of the second n-side semiconductor layer. |
申请公布号 |
US2017084787(A1) |
申请公布日期 |
2017.03.23 |
申请号 |
US201615267691 |
申请日期 |
2016.09.16 |
申请人 |
NICHIA CORPORATION |
发明人 |
EMURA Keiji;INOUE Yoshiki;KAGEYAMA Hiroaki |
分类号 |
H01L33/38;H01L33/40;H01L33/58;H01L33/62;H01L33/50;H01L27/15;H01L33/24 |
主分类号 |
H01L33/38 |
代理机构 |
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代理人 |
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主权项 |
1. A light-emitting element comprising:
a light transmissive substrate; a first semiconductor stacked body including:
a first n-side semiconductor layer located above part of the light transmissive substrate, anda first p-side semiconductor layer located above the first n-side semiconductor layer, the first p-side semiconductor layer having a hole formed therein; a first p-electrode located on the first p-side semiconductor layer; a first n-electrode having a portion above the first p-electrode, and a portion extending into the hole, the first n-electrode being electrically connected to the first n-side semiconductor layer through the hole; a second semiconductor stacked body including:
a second n-side semiconductor layer located above the light transmissive substrate around a periphery of the first semiconductor stacked body in a plan view, anda second p-side semiconductor layer located above the second n-side semiconductor layer and located outside of an inner edge portion of the second n-side semiconductor layer; a second p-electrode located on the second p-side semiconductor layer; and a second n-electrode having a portion above the second p-electrode, and being electrically connected to the inner edge portion of the second n-side semiconductor layer. |
地址 |
Anan-shi JP |