SEMICONDUCTOR DEVICE AND METHOD OF MEASURING THE SAME

摘要

A semiconductor device includes first and second contact parts that are disposed close to each other with an interval therebetween and form a screw hole (connection area) to which an external connection terminal is connected. The first contact part extends from a side of a case via a first linkage part that extends from the side, and the second contact part extends from the side via a second linkage part that extends from the side. The first and second linkage parts are disposed away from each other by at least a certain interval. In this way, the semiconductor device is allowed to have first and second semiconductor chips connected in parallel with each other and function as a semiconductor device. In addition, electrical characteristics of the first and second semiconductor chips of the semiconductor device are individually measured.

主权项

1. A semiconductor device comprising:
a first semiconductor chip and a second semiconductor chip that are disposed on a metal plate; a first electrode terminal that is electrically connected to a main electrode of the first semiconductor chip; and a second electrode terminal that is electrically connected to a main electrode of the second semiconductor chip, wherein the first electrode terminal includes a first contact part, and the second electrode terminal includes a second contact part, and wherein the first contact part and the second contact part are disposed close to each other with an interval therebetween and form a connection area to which an external connection terminal is connected.