发明名称 Blocking/Deblocking Resin Systems for Use as a "Co-Cure-Ply" in the Fabrication of Large-Scale Composite Structure
摘要 A method for bonding composite structures which includes providing a first and second composite substrate and coupling a co-cure prepreg tape having chemically protected polymerizable functional groups onto a surface of both the first and second composite substrates. The first and second composite substrates are then cured to the co-cure prepreg tape at a first temperature to form a co-cure prepreg tape portion where the first and second composite substrates are fully cured and the co-cure prepreg tape is partially cured. The co-cure prepreg tape portion of the first composite substrate is then coupled to the co-cure prepreg tape portion of the second composite substrate and a deprotection initiator is applied to facilitate deprotection of the chemically protected polymerizable functional groups and cure the co-cure prepreg tape portion of the first and second composite substrates to form a single covalently bonded composite structure.
申请公布号 US2017080685(A1) 申请公布日期 2017.03.23
申请号 US201615274147 申请日期 2016.09.23
申请人 U.S.A. as represented by the Administrator of the National Aeronautics and Space Administration 发明人 Palmieri Frank L.;Connell John W.;Wohl, JR. Christopher J.
分类号 B32B7/12;B32B37/14;B32B27/34;B32B37/12 主分类号 B32B7/12
代理机构 代理人
主权项 1. A method for bonding composite substrates comprising: providing a first composite substrate and a second composite substrate wherein both the first composite substrate and the second composite substrate are uncured or partially cured and comprise one or more reinforcement fibers and a first curable resin; coupling a co-cure prepreg tape onto a faying surface of both the first and second composite substrates wherein the co-cure prepreg tape comprises a second curable resin having one or more chemically protected polymerizable functional groups; curing the first and second composite substrates to the co-cure prepreg tape at a first temperature to form a co-cure prepreg tape portion wherein the first and second composite substrates are fully cured and the co-cure prepreg tape is partially cured; coupling the co-cure prepreg tape portion of the first composite substrate to the co-cure prepreg tape portion of the second composite substrate; applying a second temperature to facilitate deprotection with water and a hydrolysis catalyst of the chemically protected polymerizable functional groups to give unprotected polymerizable functional groups and cure the co-cure prepreg tape portion of the first composite substrate to the co-cure prepreg tape portion of the second composite substrate to form a single covalently bonded composite structure.
地址 Washington DC US