发明名称 |
Blocking/Deblocking Resin Systems for Use as a "Co-Cure-Ply" in the Fabrication of Large-Scale Composite Structure |
摘要 |
A method for bonding composite structures which includes providing a first and second composite substrate and coupling a co-cure prepreg tape having chemically protected polymerizable functional groups onto a surface of both the first and second composite substrates. The first and second composite substrates are then cured to the co-cure prepreg tape at a first temperature to form a co-cure prepreg tape portion where the first and second composite substrates are fully cured and the co-cure prepreg tape is partially cured. The co-cure prepreg tape portion of the first composite substrate is then coupled to the co-cure prepreg tape portion of the second composite substrate and a deprotection initiator is applied to facilitate deprotection of the chemically protected polymerizable functional groups and cure the co-cure prepreg tape portion of the first and second composite substrates to form a single covalently bonded composite structure. |
申请公布号 |
US2017080685(A1) |
申请公布日期 |
2017.03.23 |
申请号 |
US201615274147 |
申请日期 |
2016.09.23 |
申请人 |
U.S.A. as represented by the Administrator of the National Aeronautics and Space Administration |
发明人 |
Palmieri Frank L.;Connell John W.;Wohl, JR. Christopher J. |
分类号 |
B32B7/12;B32B37/14;B32B27/34;B32B37/12 |
主分类号 |
B32B7/12 |
代理机构 |
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代理人 |
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主权项 |
1. A method for bonding composite substrates comprising:
providing a first composite substrate and a second composite substrate wherein both the first composite substrate and the second composite substrate are uncured or partially cured and comprise one or more reinforcement fibers and a first curable resin; coupling a co-cure prepreg tape onto a faying surface of both the first and second composite substrates wherein the co-cure prepreg tape comprises a second curable resin having one or more chemically protected polymerizable functional groups; curing the first and second composite substrates to the co-cure prepreg tape at a first temperature to form a co-cure prepreg tape portion wherein the first and second composite substrates are fully cured and the co-cure prepreg tape is partially cured; coupling the co-cure prepreg tape portion of the first composite substrate to the co-cure prepreg tape portion of the second composite substrate; applying a second temperature to facilitate deprotection with water and a hydrolysis catalyst of the chemically protected polymerizable functional groups to give unprotected polymerizable functional groups and cure the co-cure prepreg tape portion of the first composite substrate to the co-cure prepreg tape portion of the second composite substrate to form a single covalently bonded composite structure. |
地址 |
Washington DC US |