SOLDER BALL APPLYING DEVICE

摘要

A solder ball applying device is disclosed. According to an embodiment of the present invention, a solder ball applying device is provided, which comprises: a storing part for storing one or more solder balls; a transfer part for sequentially transferring the respective solder balls stored in the storing part; a supplying part for supplying one solder ball transferred by the transfer part; and a nozzle part having a nozzle tip for applying the solder ball supplied by the supplying part onto a substrate. The nozzle tip comprises: a first member formed of a material that is opaque to a laser; and a second member formed a material that is transparent to the laser.