发明名称 |
POLYOLEFIN HOT-MELT GLUE HAVING A LOW REACTIVATION TEMPERATURE AND HIGH HEAT STABILITY AND USE THEREOF FOR VACUUM DEEP-DRAWING LAMINATION |
摘要 |
The invention relates to a hot-melt glue composition, comprising a) at least one atactic poly-α-olefin (APAO) that is solid at 25°C; b) at least one hydrocarbon resin having a softening point of at least 80°C, measured in accordance with the ring-and-ball method according to DIN EN 1238; and c) at least one maleic-anhydride-grafted wax having a softening point of not more than 150°C, measured in accordance with the ring-and-ball method according to DIN EN 1238, which is a maleic-anhydride-grafted polypropylene wax or a maleic-anhydride-grafted polyethylene wax, wherein the proportion of the at least one maleic-anhydride-grafted wax in the hot-melt glue composition is at least 3 wt%. The hot-melt glue composition according to the invention is characterized by a low reactivation temperature, together with high heat resistance and good adhesion to ABS and nonpolar polyolefin materials. Said hot-melt glue composition is well suited for film lamination by vacuum deep-drawing lamination, in particular for applications in automobile construction. |
申请公布号 |
WO2017046045(A1) |
申请公布日期 |
2017.03.23 |
申请号 |
WO2016EP71489 |
申请日期 |
2016.09.13 |
申请人 |
SIKA TECHNOLOGY AG |
发明人 |
JANKE, Doreen;PASCHKOWSKI, Kai;CORDES, Mathias;URBACH, Dirk |
分类号 |
C08L23/14;C08L51/06;C09J123/14 |
主分类号 |
C08L23/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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