MULTILAYER STRUCTURE, METHOD FOR PRODUCING SAME, PACKAGING MATERIAL USING SAME, PRODUCT, AND PROTECTIVE SHEET FOR ELECTRONIC DEVICES

摘要

The present invention relates to a multilayer structure which comprises a base (X), a layer (Y) and a layer (Z), and wherein: the layer (Y) contains a compound (A) containing aluminum; and the layer (Z) contains an organic phosphorus compound (BO) and a polymer (F) that has an ether bond but does not have a glycosidic bond.