SEMICONDUCTOR PACKAGE ASSEMBLIES WITH SYSTEM-ON-CHIP (SOC) PACKAGES

摘要

A semiconductor package assembly includes a first semiconductor package. The first semiconductor package has a semiconductor die having pads thereon, first vias disposed on the first semiconductor die, the first vias coupled to the pads. A second semiconductor package is stacked on the first semiconductor package and includes a body having a die-attach surface and a bump-attach surface opposite to the die-attach surface, a first memory die mounted on the bump-attach surface, coupled to the body, and a second memory die mounted on the die-attach surface, coupled to the body through the bonding wires. The number of input/output (I/O) pins of first memory die is different from the number of input/output (I/O) pins of the second memory die.

主权项

1. A semiconductor package assembly, comprising:
a first semiconductor package, comprising: a semiconductor die having pads thereon; first vias disposed on the first semiconductor die, coupled to the pads; and a second semiconductor package stacked on the first semiconductor package, comprising: a body having a die-attach surface and a bump-attach surface opposite to the die-attach surface; a first memory die mounted on the bump-attach surface, coupled to the body; and a second memory die mounted on the die-attach surface, coupled to the body through the bonding wires, wherein a number of input/output (I/O) pins of first memory die is different from a number of input/output (I/O) pins of the second memory die.