| 摘要 |
A semiconductor device includes a semiconductor chip, a lead arranged on a side portion of the semiconductor chip, and a wire, whose one end and another end are bonded to the semiconductor chip and the lead respectively, having a ball portion and a stitch portion wedged in side elevational view on the semiconductor chip and the lead respectively. An angle of approach of the wire to the lead is not less than 50°, and the length of the stitch portion is not less than 33 μm. |
| 主权项 |
1. A semiconductor device, comprising:
a semiconductor chip; leads arranged around the semiconductor chip; wires bonded to the semiconductor chip and the leads; an island to which the semiconductor chip is bonded; a chip bonding material interposed between the semiconductor chip and the island to bond the semiconductor chip and the island to each other; and a package covering a part of the island and the leads, wherein in a plan view, the island has a quadrangular shape having four sides that are each skewed relative to respective outer sides of the package, the island includes hanging portions which in the plan view, extend from respective corner portions of the island toward the respective outer sides of the package, in the plan view, each respective lead of the leads has an opposing side opposed to a nearest side of the four sides of the island which is nearest to the respective lead out of the four sides of the island, and in the plan view, a first hanging portion of the hanging portions is opposed to a first side of the respective lead, a second hanging portion of the hanging portions is opposed to a second side of the respective lead, the nearest side of the island is bridged between the first hanging portion and the second hanging portion, and the opposing side of the respective lead is bridged between the first side and the second side. |
