| 发明名称 |
BONDING PAD STRUCTURE, BONDING RING STRUCTURE, AND MEMS DEVICE PACKAGING METHOD |
| 摘要 |
The present disclosure provides bond pad structures, boning ring structure; and MEMS device packaging methods. An exemplary bonding pad structure includes a plurality of first metal blocks made of a first metal material; and a plurality of second metal blocks made of a second metal material. The plurality of first metal blocks are used to prevent the squeezing out and extending of the plurality of second metal blocks. On at least one equal dividing plane of the bonding pad structure, the first metal material is shown at least one time; and the second metal material is shown at least one time. |
| 申请公布号 |
US2017084557(A1) |
申请公布日期 |
2017.03.23 |
| 申请号 |
US201615223525 |
申请日期 |
2016.07.29 |
| 申请人 |
Semiconductor Manufacturing International (Beijing) Corporation ;Semiconductor Manufacturing International (Shanghai) Corporation |
发明人 |
CHEN FUCHENG;SHI LINBO;LIU YAO |
| 分类号 |
H01L23/00;B81C1/00 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A bonding pad structure, comprising:
a plurality of first metal blocks made of a first metal material; and a plurality of second metal blocks made of a second metal material, wherein:
the plurality of first metal blocks are used to protect squeezing out and extending of the second metal blocks; andon at least one equal dividing plane of the bonding pad structure the first metal material is shown at least one time and the second metal material is shown at least one time. |
| 地址 |
Beijing CN |
