TRANMISSION LINE BRIDGE INTERCONNECTS

摘要

In one embodiment, an integrated circuit package includes a package substrate, a printed circuit board, an interposer structure and a transmission line bridge interconnect within the interposer. The interposer structure, which includes multiple interposer layers, may be formed on a top surface of the package substrate. The printed circuit board may be coupled to the package substrate through the transmission line bridge interconnect. The transmission line may be formed on at least one of the interposer layers. The transmission line may be utilized to convey signals between the package substrate and the printed circuit board. The transmission line may be a stripline transmission line or a micro-strip transmission line. The transmission line may have a low parasitic inductance and implementation of the transmission line does not introduce large dimensional discontinuity throughout that signal pathway. The integrated circuit package may be part of a circuit system that includes external circuits.

主权项

1. An integrated circuit package, comprising:
a package substrate; an interposer structure formed at a top surface of the package substrate, wherein the interposer structure comprises a plurality of interposer layers; and a transmission line formed on at least one of the plurality of interposer layers, wherein the transmission line conveys signals between the package substrate and an external circuit.