发明名称 |
FLIP-CHIP EMPLOYING INTEGRATED CAVITY FILTER, AND RELATED COMPONENTS, SYSTEMS, AND METHODS |
摘要 |
A flip-chip employing an integrated cavity filter is disclosed comprising an integrated circuit (IC) chip comprising a semiconductor die and a plurality of conductive bumps. The plurality of conductive bumps is interconnected to at least one metal layer of the semiconductor die to provide a conductive "fence" that defines an interior resonator cavity for providing an integrated cavity filter in the flip-chip. The interior resonator cavity is configured to receive an input RF signal from an input transmission line through an input signal transmission aperture provided in an internal layer in the semiconductor die. The interior resonator cavity resonates the input RF signal to generate the output RF signal comprising a filtered RF signal of the input RF signal, and couples the output RF signal on an output signal transmission line in the flip-chip through an output transmission aperture provided in the aperture layer. |
申请公布号 |
WO2017048500(A1) |
申请公布日期 |
2017.03.23 |
申请号 |
WO2016US49440 |
申请日期 |
2016.08.30 |
申请人 |
QUALCOMM INCORPORATED |
发明人 |
LEE, John, Jong-Hoon;SONG, Young, Kyu;JOW, Uei-Ming;CHOI, Sangjo;ZHANG, Xiaonan |
分类号 |
H01P7/06 |
主分类号 |
H01P7/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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