FABRICATING PROCESS FOR PACKAGE SUBSTRATE

摘要

A core substrate is prepared first, a bottom redistribution layer RDL1 is formed. Any warpage of the RDL1 is suppressed by the core substrate. In a later process, warpage is further suppressed by a molding compound encapsulating the core substrate. A plurality of metal pillars are formed passing through the core substrate longitudinally; a top redistribution layer RDL2 is then formed on a top surface of the metal pillars.

主权项

1. A fabricating process for package substrate, comprising a fabricating process to prepare a plurality of semi-products according to the following steps:
preparing a core substrate; forming a bottom redistribution layer RDL1 on a bottom surface of the core substrate; wherein the RDL1 has a bottom redistribution circuitry embedded in bottom dielectric layers; the bottom redistribution circuitry has a plurality of first top metal pads and a plurality of first bottom metal pads; thinning from top of the core substrate; forming a plurality of holes from top of the core substrate; filling metal in each of the holes to form a plurality of metal pillars passing through the core substrate; and obtaining a plurality of semi-products through singulating.