| 发明名称 |
SEMICONDUCTOR DEVICE, LEAD FRAME, AND METHOD OF MANUFACTURING LEAD FRAME |
| 摘要 |
Provided is a lead frame that may prevent resin cracks from occurring in a semiconductor device. When a lead frame (3) is formed through press working, punching burrs (3d) are formed on tips of inner leads (3b) to serve as anchors with respect to a resin (5). The punching burrs (3d) are acute-angled projecting portions formed in a direction of a bottom surface of the semiconductor device. |
| 申请公布号 |
US2017084547(A1) |
申请公布日期 |
2017.03.23 |
| 申请号 |
US201615264101 |
申请日期 |
2016.09.13 |
| 申请人 |
SII Semiconductor Corporation |
发明人 |
ITO Mami |
| 分类号 |
H01L23/00;H01L21/56;H01L23/31;H01L23/495;H01L21/48 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A lead frame, comprising:
a tab on which a semiconductor chip is to be mounted; inner leads arranged around the tab; outer leads extending from the inner leads; and punching burrs comprising acute-angled projecting portions formed in a downward direction on tips of the inner leads. |
| 地址 |
Chiba-shi JP |
