SOLDERING MATERIAL FOR SEMICONDUCTOR DEVICE

摘要

Provided is a lead-free solder that has high heat-resistance temperature and a heat conduction property which remains unaffected in a high-temperature range. The present invention pertains to: a soldering material comprising more than 5.0 mass% but not more than 10.0 mass% of Sb, and 2.0-4.0 mass% of Ag, the remaining portion being Sn and unavoidable impurities; and a semiconductor device provided with a bonding layer containing the soldering material between a semiconductor element and a substrate electrode or a lead frame.