发明名称 ENCAPSULANT BONDING METHODS FOR PHOTOVOLTAIC MODULE MANUFACTURING
摘要 Various improved approaches to prevent solar cell motion during manufacturing of PV laminates and modules are described herein. Disclosed contactless heating methods comprise positioning a plurality of solar cells on a layer of encapsulant and heating an encapsulant bonding region within the first encapsulant layer to a temperature sufficient to adhere the plurality of solar cells to the superstrate. Compared to some heat-tacking methods and manual taping, the contactless heating methods described herein provide an accurate, high-throughput approach to inhibiting solar cell shifting during PV module manufacture.
申请公布号 WO2017048387(A1) 申请公布日期 2017.03.23
申请号 WO2016US45212 申请日期 2016.08.02
申请人 SUNPOWER CORPORATION 发明人 SETHI, Sunny;OKAWA, David
分类号 H01L31/048;H01L31/049;H01L31/05;H01L31/18;H05B3/00 主分类号 H01L31/048
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