发明名称 |
ENCAPSULANT BONDING METHODS FOR PHOTOVOLTAIC MODULE MANUFACTURING |
摘要 |
Various improved approaches to prevent solar cell motion during manufacturing of PV laminates and modules are described herein. Disclosed contactless heating methods comprise positioning a plurality of solar cells on a layer of encapsulant and heating an encapsulant bonding region within the first encapsulant layer to a temperature sufficient to adhere the plurality of solar cells to the superstrate. Compared to some heat-tacking methods and manual taping, the contactless heating methods described herein provide an accurate, high-throughput approach to inhibiting solar cell shifting during PV module manufacture. |
申请公布号 |
WO2017048387(A1) |
申请公布日期 |
2017.03.23 |
申请号 |
WO2016US45212 |
申请日期 |
2016.08.02 |
申请人 |
SUNPOWER CORPORATION |
发明人 |
SETHI, Sunny;OKAWA, David |
分类号 |
H01L31/048;H01L31/049;H01L31/05;H01L31/18;H05B3/00 |
主分类号 |
H01L31/048 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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