发明名称 FLOW RATE ADJUSTMENT DEVICE AND PROCESSING DEVICE
摘要 According to one embodiment of the present invention, a flow rate adjustment device is provided with a first wall and a plurality of second walls. The first wall has a first surface, and a second surface positioned on the reverse side of the first surface. The second walls are connected, at positions separated from each other, to the second surface, form a plurality of openings opened in the first surface, and are capable of changing the diameter of the openings by being deformed.
申请公布号 WO2017047138(A1) 申请公布日期 2017.03.23
申请号 WO2016JP59520 申请日期 2016.03.24
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 ONOUE, Seiji
分类号 C23C16/455;H01L21/31 主分类号 C23C16/455
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