发明名称 HEAT SINK
摘要 The objective of the present invention is to provide a heat sink with which the formation of boundary layers at the surfaces of heat dissipating fins is suppressed, and which has an excellent heat dissipation efficiency. This heat sink includes: a base plate in the shape of a flat plate, which is thermally coupled to a heat generating body; first heat dissipating fins which are thermally coupled to the base plate; and second heat dissipating fins which are adjacent to a side end portion of the first heat dissipating fins and are thermally coupled to the base plate, wherein the surfaces of the first heat dissipating fins are not parallel to the surfaces of the second heat dissipating fins.
申请公布号 WO2017047756(A1) 申请公布日期 2017.03.23
申请号 WO2016JP77461 申请日期 2016.09.16
申请人 FURUKAWA ELECTRIC CO., LTD. 发明人 KAWABATA Kenya;MEGURO Masahiro;CHU Kuang Yu;TSENG Hung Wei
分类号 H01L23/36;F28D15/02;H01L23/427;H05K7/20 主分类号 H01L23/36
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