| 发明名称 |
METHOD OF MANUFACTURING INSULATION FILM AND PRINTED CIRCUIT BOARD |
| 摘要 |
A method of manufacturing an insulation film includes: coating a resin composite on a lower protective film, the resin composite including an inorganic filler dispersed therein; forming an insulating layer by drying the resin composite such that the inorganic filler is precipitated in the coated resin composite; and laminating an upper protective film on the insulating layer. |
| 申请公布号 |
US2017086303(A1) |
申请公布日期 |
2017.03.23 |
| 申请号 |
US201615065383 |
申请日期 |
2016.03.09 |
| 申请人 |
Samsung Electro-Mechanic Co., Ltd. |
发明人 |
HAM Ho-Hyung;LEE Hwa-Young;LEE Jae-Kul;YOON Ok-Seon |
| 分类号 |
H05K3/10;B32B37/14;B32B38/10;H05K3/28 |
主分类号 |
H05K3/10 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of manufacturing an insulation film, comprising:
coating a resin composite on a lower protective film, the resin composite comprising an inorganic filler dispersed therein; forming an insulating layer by drying the resin composite such that the inorganic filler is precipitated in the coated resin composite; and laminating an upper protective film on the insulating layer. |
| 地址 |
Suwon-si KR |
