| 发明名称 |
SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE USING THE SAME AND MANUFACTURING METHOD THEREOF |
| 摘要 |
A semiconductor package includes a package substrate, a first electronic component and a second package body. The package substrate includes a first conductive layer, a first pillar layer, a first package body and a second conductive layer, wherein the first pillar layer is formed on the first conductive layer, the first package body encapsulates the first conductive layer and the first pillar layer, and the second conductive layer electrically connects to the first pillar layer. The first electronic component is disposed above the second conductive layer of the package substrate. The second package body encapsulates the first electronic component and the second conductive layer. |
| 申请公布号 |
US2017084541(A1) |
申请公布日期 |
2017.03.23 |
| 申请号 |
US201615162760 |
申请日期 |
2016.05.24 |
| 申请人 |
MEDIATEK Inc. |
发明人 |
Hsu Wen-Sung;Lin Shih-Chin;Cheng Tao;Chang Andrew C. |
| 分类号 |
H01L23/538;H01L21/56;H01L25/00;H01L21/48;H01L23/31;H01L25/10 |
主分类号 |
H01L23/538 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor package, comprising:
a package substrate, comprises:
a first conductive layer;a first pillar layer formed on the first conductive layer;a first package body encapsulating the first conductive layer and the first pillar layer; anda second conductive layer electrically connecting to the first pillar layer; a first electronic component disposed above the second conductive layer of the package substrate; and a second package body encapsulating the first electronic component and the second conductive layer. |
| 地址 |
Hsin-Chu TW |
