发明名称 半導体装置
摘要 A semiconductor device includes a first semiconductor region of a first conductivity type, a second semiconductor region having a second conductivity type, a first insulating layer on the first and second semiconductor regions, and field plate electrodes are provided in the first insulating layer at different distances from the first semiconductor layer. A first field plate electrode is at a first distance, a second field plate electrode is at a second distance greater than the first distance, and a third field plate electrode is at a distance greater than the second distance. The first through third field plate electrodes are electrically connected to each other and the third electrode is electrically connected to the second semiconductor region.
申请公布号 JP6101183(B2) 申请公布日期 2017.03.22
申请号 JP20130205884 申请日期 2013.09.30
申请人 株式会社東芝 发明人 末代 知子;押野 雄一;田中 文悟;河村 圭子
分类号 H01L29/06;H01L29/739;H01L29/78 主分类号 H01L29/06
代理机构 代理人
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