| 摘要 |
PROBLEM TO BE SOLVED: To provide a technology capable of improving uniformity in plasma intensity in a space near an object.SOLUTION: A plasma processing apparatus 100 includes a process chamber 1 in which a process space V is formed, a holding part for holding an object which is to be processed in the process space V, a plurality of inductive coupling type antennas 41 of which wound number is less than single circle, a high frequency power source 44 connected to the plurality of inductive coupling type antennas 41, and a partition member 5 formed by a dielectric body. Here, a center point of a line segment connecting both end parts of the plurality of respective inductive coupling type antennas 41 is arranged on a determined virtual axis such that the plurality of inductive coupling type antennas 41 are arrayed along the virtual axis in a line, with the partition member arranged between adjoining inductive coupling type antennas. |
