发明名称 不良検出装置及び不良検出方法
摘要 PROBLEM TO BE SOLVED: To provide a defect detection device capable of accurately detecting defects of a semiconductor device.SOLUTION: A defect detection device 100 includes: a measuring part 40 for measuring a first time period starting from an input of a signal into a test object device 200 until a reception of a reflection signal reflected on a defective point of the test object device; a storage part 30 for storing model data indicating a conduction characteristic corresponding to each of a plurality of parts or a plurality of portions; a control unit 20 for dividing a test object range in the test object device into a first part and a second part which is away from the measuring part in comparison with the first part on the basis of a conduction characteristic of each area, inputting a signal into the first part and then substituting a second time period obtained by subtracting a time period corresponding to a time taken to receive the reflected signal from the first time period in order to calculate a first predicted conduction distance in the second part; and a display part for displaying the location of the defective point in image data on the basis of the calculation result.SELECTED DRAWING: Figure 1
申请公布号 JP6101387(B2) 申请公布日期 2017.03.22
申请号 JP20160101541 申请日期 2016.05.20
申请人 株式会社東芝 发明人 瀬戸 基司;村上 浩明
分类号 G01R31/11;G01R31/02;G01R31/28 主分类号 G01R31/11
代理机构 代理人
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