| 摘要 |
PROBLEM TO BE SOLVED: To provide a humidity conditioning module capable of easily joining junction parts with fewer machining restrictions.SOLUTION: Junction members (65, 66, 71, 77) made of shape memory alloy deformed so as to form seal portions (S1, S2, S3) of at least either liquid absorbent or a heat medium are provided in at least either an absorption unit (50) or a heat transfer unit (70). |
