| 摘要 |
PROBLEM TO BE SOLVED: To provide a device and a method for mounting an IC component highly accurately and efficiently by obtaining an image with bumps formed on an electrode of an IC component for performing image processing to the obtained image.SOLUTION: A device for mounting an IC component comprises: an imaging device which obtains an image on a bump forming surface of an IC chip on which plural bumps are formed; plural processing elements which perform digital data processing to the obtained image, detect an apex for each of the bumps using the processed image data, and process in parallel with calculation of a center gravity position and calculation of a feature quantity of the bumps; and a positioning arithmetic processing section which calculates each position of the bumps and a position and a posture of the IC chip on the basis of the result of the parallel processing, and determines a mounting position of the IC chip on a circuit board on the basis of each position of the bumps and the position and the posture of the IC chip calculated. |
