发明名称 Method for manufacturing a silver alloy wire for bonding applications
摘要 The invention is related to a bonding wire, comprising: a core with a surface, wherein the core comprises silver as a main component and at least one member selected from the group consisting of gold, palladium, platinum, rhodium, ruthenium, nickel, copper and iridium, characterized in that the bonding wire has at least one of the following properties: i) an average size of crystal grains of the core is between 0.8 µm and 3 µm, ii) the amount of crystal grains having an orientation in <001> direction in the cross section of the wire is in the range of 10 €• 20 %, iii) the amount of crystal grains having an orientation in <111> direction in the cross section of the wire is in the range of 5 €•15 %, and iv) the total amount of crystal grains having an orientation in <001> direction and of crystal grains having an orientation in <111> direction in the cross section of the wire is in the range of 15 €• 40 %.
申请公布号 EP2703116(B1) 申请公布日期 2017.03.22
申请号 EP20120006236 申请日期 2012.09.04
申请人 Heraeus Deutschland GmbH & Co. KG 发明人 Ryu, Jae-Sung;Chung, Eun-Kyun;Tark, Yong-Deok
分类号 B23K35/30;C22C5/06 主分类号 B23K35/30
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