| 摘要 |
PROBLEM TO BE SOLVED: To suppress occurrence of cracks between a plurality of grooves, and to suppress destruction of a semiconductor laser element.SOLUTION: A semiconductor laser element comprises a semiconductor part including an optical waveguide region, and uses a cleavage surface of the semiconductor part as a resonator end surface. In a plan view, on a surface of the semiconductor part, at least paired grooves are provided on both sides of the optical waveguide region. The paired grooves are arranged so as not to be overlapped with each other in a direction parallel to the resonator end surface. |
