| 发明名称 |
STABLE, HIGH RATE SILICON SLURRY |
| 摘要 |
The invention provides a chemical-mechanical polishing composition comprising wet-process silica, a stabilizer compound, a potassium salt, a secondary amine compound, and water. The invention further provides a method of polishing a substrate with the polishing composition. |
| 申请公布号 |
EP2297263(B1) |
申请公布日期 |
2017.03.22 |
| 申请号 |
EP20090750923 |
申请日期 |
2009.05.07 |
| 申请人 |
Cabot Microelectronics Corporation |
发明人 |
WHITE, Michael;GILLILAND, Jeffrey;JONES, Lamon;WALTERS, Alicia |
| 分类号 |
C09K3/14;C09G1/02;H01L21/02 |
主分类号 |
C09K3/14 |
| 代理机构 |
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代理人 |
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