发明名称 電子機器、実装基板、及び実装基板の製造方法
摘要 PROBLEM TO BE SOLVED: To provide an electronic device which enables electronic components to be compactly mounted on a mounting board.SOLUTION: The electronic device includes an electronic component 10 and a mounting board 20. The electronic component 10 includes: a first terminal portion 11; a second terminal portion 12 disposed at a distance from the first terminal portion 11; and a first convexoconcave portion 13 formed in at least one part between the first terminal portion 11 and the second terminal portion 12. The mounting board 20 has the electronic component 10 mounted thereon, and a second convexoconcave portion 23 is formed at a position corresponding to the first convexoconcave portion 13 formed in the electronic component 10. A convex portion 24 of the second convexoconcave portion 23 faces a concave portion 14 of the first convexoconcave portion 13.
申请公布号 JP6099135(B2) 申请公布日期 2017.03.22
申请号 JP20130065506 申请日期 2013.03.27
申请人 日本電気通信システム株式会社 发明人 田原 博光
分类号 H01F30/10;H01F27/02;H01F27/06;H01F27/32;H05K1/18 主分类号 H01F30/10
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