发明名称 Vertical LED chip structure and manufacturing method therefor
摘要 The present invention provides a vertical LED chip structure and a manufacturing method therefor. A transparent conducting contact layer, a low-refractive index dielectric layer provided with a distribution pattern, and a reflecting layer are sequentially formed on a P-GaN layer to form a composite reflecting mirror. In this way, the low-refractive index dielectric layer can account for a large area of the composite reflecting mirror, and the light absorption ratio of the reflecting mirror can be greatly reduced. Moreover, as the transparent conducting contact layer has high transverse electrical conductivity, current can be uniformly distributed on the whole P-GaN layer, and the comprehensive and effective reflectivity of the composite reflecting mirror can be effectively increased.
申请公布号 GB2542542(A) 申请公布日期 2017.03.22
申请号 GB20170001184 申请日期 2015.08.05
申请人 Enraytek Optoelectronics Co., Ltd. 发明人 Mengyan Lv;Qiong Zhang;Ling Tong;Yu Zhang;Qiming Li
分类号 H01L33/46;H01L33/36 主分类号 H01L33/46
代理机构 代理人
主权项
地址